The AI revolution is here, but why is there a shortage of NVIDIA chips? Everyone talks about the "CoWoS" bottleneck at TSMC, but most people get it wrong. You might think CoWoS is just a single packaging technology. It’s not.
To balance extreme performance, cost, and massive chip sizes, TSMC has actually evolved CoWoS into three distinct "variants": CoWoS-S, CoWoS-R, and CoWoS-L.
What are the differences? Why does Jensen Huang (NVIDIA) rely on them? Which version is the new monster chip "Blackwell" using? In this video, we break down complex semiconductor engineering into a story that anyone can understand.
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#TSMC #Semiconductor #CoWoS #NVIDIA #Technology
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